Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
(Author) Zhang Shuye
Format:
Hardcover
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Information
Publisher:
Institution of Engineering & Technology
Format:
Hardcover
Number of pages:
None
Language:
en
ISBN:
9781837241408
Publish year:
2025
Publish date:
July 1, 2025
Weight:
1 lb