Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
High Performance Compute and System-In-Package
(Author) Keser Beth
Format:
Hardcover
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Information
Publisher:
Wiley-IEEE Press
Format:
Hardcover
Number of pages:
None
Language:
en
ISBN:
9781119793779
Publish year:
2021
Publish date:
Dec. 29, 2021
Weight:
1 lb